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Interface delamination characterization: in-situ testing and integrated image correlation

le 8 janvier 2015
13H30

J.P.M. Hoefnagels, interviendra à l'ENS Cachan lors du séminaire du LMT

J.P.M. Hoefnagels, M. Kolluri, B. Blaysat, J.A.W. van Dommelen, and M.G.D. Geers
Eindhoven University of Technology (TU/e), the Netherlands
j.p.m.hoefnagels@tue.nl

ABSTRACT

Interfacial delamination is a key reliability challenge in composites and micro-electronic systems due to (high-density) integration of dissimilar materials. Predictive finite element models are used to minimize delamination failures during design, but require accurate interface models to capture (irreversible) crack initiation and propagation behavior observed in experiments. Therefore, we developed a novel miniature in-situ SEM delamination setup for all mode mixities, and demonstrated that the mixed-mode mechanical interface behavior can be fully quantified and even predicted. However, this approach is quite cumbersome. Hence, a dedicated Integrated Digital Image Correlation strategy has been developed for direct, accurate determination of interface behavior from
simple mixed-mode in-situ delamination experiments. This method has been validated on virtual and real mode-I delamination experiments.


Type :
Séminaires - conférences
Lieu(x) :
Campus de Cachan
Amphi e-média
Bâtiment Léonard De Vinci de - ENS Cachan
61, avenue du Président Wilson 94230 Cachan
Plan d'accès

Agenda des séminaires 2013


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